Quick Turn Rework and Reballing

Our services are created to meet all the repair and rework requirements that any client may have including:

• PCB Reballing:We can reball across BGA designs including lead free BGA, eutectic-ball BGA, and high temperature Chip Ball Grid Array (CBGA).
• Pad and Track Repair:We repair damage on the PCB surface related to SMT pads and tracks. We even fix poor quality work that may have been done on the PCB.
• BGA Site Modification: We undertake Site Modification without extensively changing the BGA site. We utilize flat, thin, ribbon jumper wires, which can fit easily under the BGA to achieve this.
• Damaged or Missing BGA pads:We utilize industry approved adhesives to allow the BGA to bond with the board.
• Component removal and replacement:We utilize air vacuum equipment to remove and replace BGA pads.